| No. |
TEST ITEM |
TEST METHOD |
CRITERION |
PURPOSE |
REFERENCE
STANDARD |
CONDITION |
TEST
TIME |
| 1 |
High-temperature storage |
JEITA
EIAJ ED-4701/201
MIL-STD-883 1008.2 |
Ta=125°C |
1000h |
It is due to the electric characteristic standard. |
It evaluates the tolerance when saving at high temperature in the long. |
| 2 |
High-temperature operating life |
JEITA
EIAJ ED-4701/101
MIL-STD-883 1005.8 |
Ta=125°C
VDD=MAX |
1000h |
It is due to the electric characteristic standard. |
It evaluates the tolerance when gaining a long electric stress and a thermal stress. |
| 3 |
Temperature humidity bias |
JEITA
EIAJ ED-4701/102
MIL-STD-883 1005.2 |
Ta=85°C
RH=85%
VDD=MAX*1 |
1000h |
It is due to the electric characteristic standard. |
It evaluates the tolerance of the use and the save in the long and high humidity. |
| 4 |
Pressure cooker |
JEITA
EIAJ ED-4701/102 |
Ta=125°C
RH=85%
2 atm*1 |
100h |
It is due to the electric characteristic standard. |
It evaluates a degradation phenomenon by the moisture which is one of the defects of the resin seal type semiconductor acceleratingly. |
| 5 |
Temperature cycle |
JEITA
EIAJ ED-4701/105
MIL-STD-883 1010.7 |
-55°C/RT/125°C
(30min/5min/
30min) |
100
cycle |
It is due to the electric characteristic standard. |
The device evaluates tolerance to the influence of the high temperature and the cold extreme environment change. |
| 6 |
Resistance to soldering heat |
JEITA
EIAJ ED-4701/301
JEITA
EIAJ ED-4701-302
JIS-C0050,C0054 |
IR Reflow
Ta=255±5°C
2 Times*2 |
10sec |
The malfunction on the outward appearance isn't admitted and meets a specification electrically. |
It evaluates the ability to endure a heating stress by the soldering. |
| 7 |
Solderbility |
JEITA
EIAJ ED-4701/303
MIL-STD-883 2003.7 |
Ta=240°C |
3sec |
Equal to or more than 95% of the outerlead is matted. |
It judges that it is easy to do the having of the solder of the soldering terminal. |
| 8 |
Terminal strength |
Pulling |
JEITA
EIAJ ED-4701/401 |
THD:
5 or 10N
SMD:
1 or 2.5N
Except for non lead package |
10sec |
The malfunction on the outward appearance isn't admitted and meets a specification electrically. |
The terminal part judges whether to endure sufficiently during the construction and treatment. |
| Bending |
90°
Except for SMD
Except for non lead package |
Twice of
round-trip |
It doesn't break and it meets a specification electrically. |
The terminal part judges whether to endure sufficiently during the construction and treatment. |
| 9 |
Permanence of marking |
JEITA
EIAJ ED-4701/501
JIS-C0052 |
Ta=23°C
Solvent soaking
Except for laser mark |
5min |
It meets an outward appearance and the specification of the display. |
It confirms that it doesn't become difficult when a display is put to solvent to decipher. |
| 10 |
Electrostatic discharges |
JEITA
EIAJ ED-4701/304
(MM) |
Capacitor charge method
C=200pF
R=0Ω
N=5PC's/each
Ta=RT
Positive and negative strengths
of all pins |
All terminal
Over ±300V |
It evaluates tolerance to the static electricity to receive while the device is treating. |
| MIL-STD-883 3015.7(HBM) |
Capacitor charge method
C=100pF
R=1.5kΩ
N=3PC's/each
Ta=RT
Positive and negative strengths of all pins |
All terminal
Over ±2000V |
It evaluates tolerance to the static electricity to receive while the device is treating. |
| 11 |
Latch-up |
JEITA
EIAJ ED-4701/306 |
Current input method
VDD=MAX
Ta=RT
To VDD pin:
+100mA
To VSS pin:
-100mA
Impressed condition: Pulse width: 10msec
Risetime: 500µsec |
All I/O terminal
Over ±100mA |
The evaluation of the latch up to the device. |
*1 Pre-condition:85°C/85% 168hrs→Infrared reflow Ta=255±5°C 10sec 2Times(only SMD)
Reliability testing
