Differential output oscillator is critical for improving processing speed of telecommunication equipments and server computers. Seiko NPC provides differential output oscillator of quicker performance by utilizing high frequency oscillation technology and differential output conversion technology for PECL, LVDS, etc. Differential output oscillator is appropriate for SAW(Surface Acoustic Wave) oscillator.

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Products for Differential Output Oscillator

Device Function Features Supply voltage
[V]
Recommended
oscillation
frequency
[MHz]
Package Data sheet
7051
series
Fund.3rd O.T.High freq.Diff. Differential output oscillator IC available for 2.5V, 3.3V operation.
LV-PECL
For 3rd overtone oscillation of 105MHz to 170MHz, and fundamental oscillation of 80MHz to 320MHz
Operating temperature: -40 to 125°C
2.375~3.63 [Fundamental]
80~320
[3rd Overtone]
105~170
Chip Contact us
5060/5061/5062
series
Fund.3rd O.T.High freq.Diff. Differential output oscillator IC available for 1.8V, 2.5V, 3.3V operation.
5060 : LV-PECL
5061 : LVDS
5062 : HCSL
For 3rd overtone oscillation of 50MHz to 175MHz, and fundamental oscillation of 25MHz to 175MHz
Operating temperature: -40 to 125°C
1.8~3.63 [Fundamental]
25~175
[3rd Overtone]
50~175
WaferChip Contact us
5086/5087
series
SAWDiff. SAW oscillation IC for high frequency, differential output SAW oscillator fabricated through unique BiCMOS process.
5086 : LV-PECL
5087 : LVDS
2.375~3.6 300~700 WaferChip PDFPDF
5036/5037
series
Fund.3rd O.T.SAWHigh freq.Diff. Crystal oscillator IC for high frequency, differential output crystal oscillator fabricated through unique BiCMOS process.
5036 : LV-PECL
5037 : LVDS
2.375~3.6 50~600
80~600
Chip PDFPDF
Fund. Fundamental Oscillator 3rd O.T. 3rd Overtone Oscillator SAW SAW Oscillator High freq. High-frequency
Diff. Differential output Ultra mini Ultra miniature package Wafer Wafer form Chip Chip form