SEIKO NPC Corporation (HQ: Chuo-ku, Tokyo, President: Hiroaki Okawa) has developed thermopile-type infrared array sensor module with 8 x 8 elements “SMH-01B01”, miniaturized by mounting Si-lens optical system for far infrared radiation, detection circuit and control MCU on a single board.
This module is equipped with a COB(chip on board) sensor IC and an Si-lens optical system, and features an MCU with built-in A/D converter that generates digital output, on an I2C interface, of both the converted emission temperature of each sensor element and the ambient temperature. The module also has a built-in 20 to 200 variable gain preamplifier which enables measurement of wide temperature range using auto range control by software.
Compared with existing sensors, advantages of this module are high output sensitivity and wide range of temperature detection that satisfy the needs of electronic and industrial equipments(air-conditioner, medical equipment, automobile, etc.).
Features and specification
- 64 elements in 8×8 square array configuration
- Switchable frame measurement speed:4,2,1fps (switching by software)
- Si lens optical system:35°total field-of-view angle
(between peak value of elements on both sides)
- Digital output by 10-bit ADC (I2C)
- Sensor IC with built-in 20 to 200 variable gain preamplifier
- Ambient temperature detection using band-gap sensor,
with built-in temperature correction coefficient
- Emission temperature resolution: ±1.5℃
- Supply voltage: 5.0V±5%, Current consumption: 5mA(typ)
- Storage temperature: -40 to 100℃, Operating temperature: -20 to 70℃
(temperature characteristics confirmation range: 5 to 45℃)
- Module dimensions: 16 x 25 x 7.8mm
- Main Applications：Disaster prevention monitoring equipment, security device, simple thermography equipment, air conditioner, microwave oven
Example of Temperature Images
Layout, and Dimensions
Thank you for coming to “Infrared Array Sensor Forum 2016”.
If you have any questions regarding this product, please feel free to contact us.
Seiko NPC will be giving a lecture and exhibition of the module at “Infrared Array Sensor Forum 2016” (Ritsumeikan University, Osaka-Ibaraki Campus) on July29, 2016.